Study of heat transfer in microscale systems

被引：0

作者：

Pryputniewicz, Ryszard J. ^{[1
]}

Pryputniewicz, Dariusz R. ^{[1
]}

机构：

[1] Worcester Polytech Inst, Dept Mech Engn, CHSLT, NEST NanoEngn Sci & Technol, Worcester, MA 01609 USA

来源：

IPACK 2007: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2007, VOL 1 | 2007年

关键词：

MEMS; microscale systems; mu ChemLab; GaAsFET amplifier; thermal analysis; package level model; chip level model; measurements;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Progress in micromachining technology enabled fabrication of micron-sized mechanical devices, which have had a major impact on many disciplines. These devices have not only led to development of miniature transducers for sensing and actuation, but also a chip-based chemical laboratory (mu ChemLab) and other microelectromechanical systems (MEMS). Applications of these microscale systems frequently demand heat removal and temperature control. This paper presents preliminary results of a study of heat transfer in microscale systems. Computational modeling is based on Thermal Analysis System (TAS), which facilitates multiscale modeling/simulation, and measurements are made using infrared (IR) microscopy. Representative applications describe multiscale modeling and measurement results obtained for a microhotplate of a mu ChemLab and a highpower GaAs FET amplifier. Comparison of the preliminary experimental/measurement and computational/modeling results shows good correlation.

引用

页码：155 / 162

页数：8

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