Study of heat transfer in microscale systems

被引:0
|
作者
Pryputniewicz, Ryszard J. [1 ]
Pryputniewicz, Dariusz R. [1 ]
机构
[1] Worcester Polytech Inst, Dept Mech Engn, CHSLT, NEST NanoEngn Sci & Technol, Worcester, MA 01609 USA
来源
IPACK 2007: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2007, VOL 1 | 2007年
关键词
MEMS; microscale systems; mu ChemLab; GaAsFET amplifier; thermal analysis; package level model; chip level model; measurements;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Progress in micromachining technology enabled fabrication of micron-sized mechanical devices, which have had a major impact on many disciplines. These devices have not only led to development of miniature transducers for sensing and actuation, but also a chip-based chemical laboratory (mu ChemLab) and other microelectromechanical systems (MEMS). Applications of these microscale systems frequently demand heat removal and temperature control. This paper presents preliminary results of a study of heat transfer in microscale systems. Computational modeling is based on Thermal Analysis System (TAS), which facilitates multiscale modeling/simulation, and measurements are made using infrared (IR) microscopy. Representative applications describe multiscale modeling and measurement results obtained for a microhotplate of a mu ChemLab and a highpower GaAs FET amplifier. Comparison of the preliminary experimental/measurement and computational/modeling results shows good correlation.
引用
收藏
页码:155 / 162
页数:8
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