Sputter deposition of undoped and doped SiO2 films for temperature compensated SAW components

被引：0

作者：

Bartzsch, Hagen ^{[1
]}

Hildisch, Jan ^{[1
]}

Taeschner, Kerstin ^{[1
]}

Barth, Stephan ^{[1
]}

Rueckriem, Robert ^{[2
]}

Nestler, Matthias ^{[2
]}

机构：

[1] Fraunhofer FEP, Dresden, Germany

[2] Scia Syst GmbH, Chemnitz, Germany

来源：

2019 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IUS) | 2019年

关键词：

TC-SAW; SiOF; magnetron sputtering; reactive magnetron sputtering;

D O I：

10.1109/ultsym.2019.8925909

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Reactive magnetron sputter deposition is shown to be a suitable method for depositing Fluorine doped silica films for temperature compensated SAW devices.

引用

页码：731 / 734

页数：4

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