Study on electrocrystallization of pulse micro-electroforming in UV-LIGA

被引:0
|
作者
Shao, Ligeng [1 ]
Du, Liqun [1 ]
Wang, Liding [1 ]
机构
[1] Dalian Jiaotong Univ, Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian, Liaoning, Peoples R China
基金
中国国家自然科学基金;
关键词
pulse micro-electroforming; overpotential; electrocrystallization; crystal growth;
D O I
10.1109/ICMA.2007.4303951
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
UV-LIGA is one of the main fabrication technology in MEMS and micro-electroforming is a key procedure in UV-LIGA. Microstructures with small grains, high density and high aspect ratio can be obtained easily by pulse current micro-electroforming than by direct current micro-electroforming. In this study, the relationship between overpotential and time is established by multi-current step method under various pulse current parameters. It is shown that overpotential is the primary kinetics factor that induces electro-deposition on the cathode. On basis of adsorptive layer theory, the concept of positive metal atom in intermediate state is used to analyse the crystal seed production and nucleation. A related model of crystal nucleus formation is set up. The results are also shown that intermediate metal atoms can grow into crystal seeds under certain conditions, and crystal seeds can grow into crystal nuclei. The change trend of nucleus size in the course of crystal growth is forecasted. The crystal grain diameter of Ni microstructure in micro-electroforming experiment is about 8 r(crit), where r(crit) is the critical radius of nuclei.
引用
收藏
页码:2513 / 2517
页数:5
相关论文
共 50 条
  • [41] UV-LIGA Microfabrication of 0.3 THz Double Corrugated Waveguide
    Sabaawi, Ahmed
    Doychinov, Viktor
    Mathisen, Storm
    Steenson, David P.
    Letizia, Rosa
    Paoloni, Claudio
    2017 EIGHTEENTH INTERNATIONAL VACUUM ELECTRONICS CONFERENCE (IVEC), 2017,
  • [42] UV-LIGA制作微细群电极工艺研究
    胡洋洋
    朱荻
    曾永彬
    明平美
    电加工与模具, 2008, (01) : 29 - 31+35
  • [43] Fabrication of metal micro-precision sieves with high open areas using UV-LIGA process
    Ming, Ping-Mei
    Zhu, Di
    Zhou, Feng
    Hu, Yang-Yang
    Zeng, Yong-Bin
    Guangxue Jingmi Gongcheng/Optics and Precision Engineering, 2009, 17 (06): : 1267 - 1273
  • [44] Experiment design and UV-LIGA microfabrication technology to study the fracture toughness of Ni microstructures
    Dai, W
    Oropeza, C
    Lian, K
    Wang, WJ
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2006, 12 (04): : 306 - 314
  • [45] Multilevel electroforming for the components of a microdroplet ejector by UV LIGA technology
    Cheng, CH
    Chen, SC
    Chen, ZS
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2005, 15 (04) : 843 - 848
  • [46] Analysis for replication and surface roughness of micro-feature of silicon mold insert by UV-LIGA method
    Huang, Chiung-Fang
    Lee, Jeol-Long
    Shen, Yung-Kang
    Wu, Chi-Wei
    Lin, Yi
    Hsu, Sung-Chih
    Wu, Ming-Wei
    Kao, Chung-Yu
    MULTI-FUNCTIONAL MATERIALS AND STRUCTURES, PTS 1 AND 2, 2008, 47-50 : 443 - +
  • [47] UV-LIGA双层微齿轮加工工艺研究
    张晔
    陈迪
    潘欣欣
    方华斌
    朱军
    刘景全
    微细加工技术, 2005, (04) : 69 - 75
  • [48] Vacuum Micro-electroforming Technique for the Production of Void-free Microcomponent
    Ming, P. M.
    Zhu, D.
    Zhou, F.
    Hu, Y. Y.
    FUNCTIONAL MANUFACTURING TECHNOLOGIES AND CEEUSRO I, 2010, 426-427 : 142 - 146
  • [49] Using micro-electroforming and micro-assembly technology to fabricate vertical probe card
    Huang, Jung-Tang
    Lee, Kou-Yu
    Wu, Chan-Shoue
    Lin, Chung-Yi
    Shih, Sheng-Hsiung
    2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, 2006, : 654 - 658
  • [50] Micro-electroforming Metallic Bipolar Electrodes for Mini-DMFC Stacks
    Shyu, R. F.
    Yang, H.
    Lee, J. -H.
    DTIP 2008: SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS, 2008, : 192 - +