Heterogeneous Integration through Direct Wafer Bonding

被引：0
|
作者：
Eibelhuber, M. [1 ]
Razek, N. [1 ]
Dragoi, V. [1 ]
Flotgen, C. [1 ]
Wimplinger, M. [1 ]
Uhrmann, T. [1 ]
机构：
[1] EVGroup, A-4782 St Florian Am Inn, Austria
来源：
2015 IEEE 17TH ELECTRONICS PACKAGING AND TECHNOLOGY CONFERENCE (EPTC) | 2015年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Recent developments in direct wafer bonding make this technology a versatile tool for heterogeneous integration. Advances in process flows and equipment technology trigger new types of application schemes for novel types of device architecture.
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收藏
页数：2
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