Micromechanical devices with embedded electro-thermal-compliant actuation

At the micro-scale, thermal actuation provides larger forces compared to the widely-used electrostatic actuation. In this paper, we highlight another advantage of thermal actuation, viz. the ease with which it can be utilized to achieve a novel embedded electro-thermal-compliant (ETC) actuation for MEMS. The principle of ETC actuation is based on the selective non-uniform Joule heating and the accompanying constrained thermal expansion. It is shown here that appropriate topology and shape of the structures give rise to many types of actuators and devices. Additionally, selective doping of silicon ETC devices is used to enhance the non-uniform heating and thus the deformation. A number of novel ETC building blocks and devices are described, and their analysis and design issues are discussed. The devices were microfabricated using MCNC's MUMPs foundry process as well as a bulk-micromachining process called PennSOIL (Penn silicon-on-insulator layer). The designs are validated with the simulations and the experimental observations. The experimental measurements are quantitatively compared with the theoretical predictions for a novel ETC microactuator with selective doping. (C) 2001 Elsevier Science B.V. All rights reserved.