Microwave flip chip and BGA technology

被引：0
|
作者：
Bedinger, JM [1 ]
机构：
[1] Raytheon Elect Corp, Dallas, TX 75246 USA
来源：
2000 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3 | 2000年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Topics in this paper discuss flip chip and BGA packaging and related assembly issues important in the design of microwave power amplifier and integrated transceiver,MMIC's Environmental stress, thermal management electrical performance, and inspection issues associated with flip chip and ball-grid array packaging will be discussed. The selection of solders, insulating,substrates and underfill, will be presented with supporting data for various materials and geometries.
引用
收藏
页码：713 / 716
页数：4
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