Process check time reduction by the application of an in-line thin film thickness measurement tool

被引：0
|
作者：
Murata, K [1 ]
Saeki, K [1 ]
机构：
[1] NEC Fabserve Ltd, Sagamihara, Kanagawa, Japan
来源：
ISSM 2005: IEEE International Symposium on Semiconductor Manufacturing, Conference Proceedings | 2005年
关键词：
D O I：
10.1109/ISSM.2005.1513362
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Efficiency improvement of productivity is required for the semiconductor fabrication line. It is very effective to reduce the PC(Process Check) time for efficiency improvement of productivity. To reduce PC time, we evaluated the in-line thin film thickness measurement tool. The result of the application of the inline thin film thickness measurement tool, we succeeded to reduce RESIST and BARC film thickness inspection time dramatically as compared with the conventional film thickness inspection time, and proved that the investment efficiency of RESIST and BARC film thickness control was improved.
引用
收藏
页码：299 / 302
页数：4
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