Numerical Simulation of Compression Molding of UHMWPE Part I. Thermal Model

被引:0
|
作者
Parasnis, N. C. [1 ]
Ramani, K. [1 ]
机构
[1] Purdue Univ, Sch Mech Engn, Composites & Polymer Proc Lab, Room 308, W Lafayette, IN 47907 USA
关键词
D O I
10.1515/ipp-2000-0010
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
In this paper we describe a model to predict crystallinity from thermal history while compression molding UHMWPE. A thermal model is used for temperature predictions within a compression molded disc. The temperature predictions are used in a residual stress model (see Part II of this paper). Three different process cycles were studied, one with fast cooling, one with slow cooling and one with soak at crystallization.
引用
收藏
页码:180 / 193
页数:14
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