Numerical Simulation of Compression Molding of UHMWPE Part I. Thermal Model

被引:0
|
作者
Parasnis, N. C. [1 ]
Ramani, K. [1 ]
机构
[1] Purdue Univ, Sch Mech Engn, Composites & Polymer Proc Lab, Room 308, W Lafayette, IN 47907 USA
关键词
D O I
10.1515/ipp-2000-0010
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
In this paper we describe a model to predict crystallinity from thermal history while compression molding UHMWPE. A thermal model is used for temperature predictions within a compression molded disc. The temperature predictions are used in a residual stress model (see Part II of this paper). Three different process cycles were studied, one with fast cooling, one with slow cooling and one with soak at crystallization.
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页码:180 / 193
页数:14
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