Chemorheology of a highly filled epoxy compound

被引:15
|
作者
Spoelstra, AB
Peters, GWM
Meijer, HEH
机构
[1] Centre for Polymers and Composites, Eindhoven University of Technology
来源
POLYMER ENGINEERING AND SCIENCE | 1996年 / 36卷 / 16期
关键词
D O I
10.1002/pen.10612
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
Based on measurements of the dynamic viscosity, a strategy is proposed to find an expression that relates the viscosity of an epoxy compound during curing, to the temperature, shear rate, and degree of reaction. It appeared that the dynamic viscosity is a unique function of the effective shear rate (i.e. the product of frequency and strain) over a wide range of frequencies and strains after being corrected for the temperature. The effective shear rate dependence of the viscosity is described with a power law with an exponent that depends on the conversion. The effect of temperature is described with an Arrhenius-type equation with conversion dependent parameters. Differential scanning calorimetry is applied to determine the kinetic equation that is used, in combination with the thermal history, to obtain the conversion during the rheological measurements. The description of the viscosity gives a good prediction of the measured viscosity in the region behveen melting and gelation of the compound. The theories proposed in the literature to detect the gel point from dynamic experiments are examined. It is found that neither the G'-G '' crossover, investigated by e.g. Tung and Dynes (i), nor the frequency-independence of tan(delta), described by Winter (2, 3), can be used to determine the gel point of the given material. In contrast, the curves of G' against conversion for measurements performed at equal strain but with different thermal histories appear to converge at a conversion of similar to 18%,which agrees with the gel point determined through extraction experiments.
引用
收藏
页码:2153 / 2162
页数:10
相关论文
共 50 条
  • [32] Characterization of epoxy based highly filled die attach materials in microelectronics
    Maus, I.
    Liebl, C.
    Fink, M.
    Vu, D. -K.
    Hartung, M.
    Preu, H.
    Jansen, K. M. B.
    Michel, B.
    Wunderle, B.
    Weiss, L.
    2017 18TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2017,
  • [34] PREFAILURE DAMAGE PROCESSES IN HIGHLY FILLED GLASS MICA EPOXY COMPOSITES
    REGOLA, M
    BAER, E
    HILTNER, A
    JOURNAL OF APPLIED POLYMER SCIENCE, 1991, 42 (09) : 2563 - 2577
  • [35] CHEMORHEOLOGY OF EPOXY-RESIN .1. EPOXY-RESIN CURED WITH TERTIARY AMINE
    CHENG, KC
    CHIU, WY
    HSIEH, KH
    MA, CCM
    JOURNAL OF MATERIALS SCIENCE, 1994, 29 (03) : 721 - 727
  • [36] Reaction kinetics and chemorheology of a highly reactive PU system
    Kim, DS
    Macosko, CW
    KOREA POLYMER JOURNAL, 1996, 4 (01): : 54 - 60
  • [37] Cure Kinetics and Chemorheology of Silicone Rubber Modified Epoxy/Clay Nanocomposites
    Lee, Sangmook
    POLYMER-KOREA, 2020, 44 (02) : 163 - 169
  • [38] Cure Behavior and Chemorheology of Low Temperature Cure Epoxy Matrix Resin
    Na, Hyo Yeol
    Yeom, Hyo Yeol
    Yoon, Byung Chul
    Lee, Seong Jae
    POLYMER-KOREA, 2014, 38 (02) : 171 - 179
  • [39] CHEMORHEOLOGY ON SIMULTANEOUS IPN FORMATION OF EPOXY-RESIN AND UNSATURATED POLYESTER
    LIN, MS
    CHANG, RJ
    JOURNAL OF APPLIED POLYMER SCIENCE, 1992, 46 (05) : 815 - 827
  • [40] Chemorheology of reactive graphitic nanofiber-reinforced epoxy as a composite matrix
    Zhamu, A.
    Jana, S.
    Salehi-Khojin, A.
    Kolodka, E.
    Gan, Y. X.
    Zhong, W. H.
    COMPOSITE INTERFACES, 2007, 14 (03) : 177 - 198