A Low-Power Wireless Bondwire Inertial Sensor System

被引:0
|
作者
Huang, Shih-Chieh [1 ]
Lu, Shao-Yung [2 ]
Cheng, Fu-Yuan [1 ]
Tsai, Tsung-Heng [1 ]
Liao, Yu-Te [2 ]
机构
[1] Natl Chung Cheng Univ, Dept Elect Engn, Chiayi, Taiwan
[2] Natl Chiao Tung Univ, Dept Elect & Comp Engn, Hsinchu, Taiwan
来源
关键词
Bondwire; Accelerometer; Inertial sensor; CMOS integration; ACCELEROMETER;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents the design and implementation of a fully-integrated CMOS accelerometer using bondwires as sensing devices without Micro Electro-Mechanical Systems (MEMS) processes. The model and analysis of bondwire inertial sensors are provided for further implementation of low-power and low-noise accelerometers. Finite element method (FEM) simulation is performed to verify the concept and model. This paper also proposes a closed-loop readout interface that suppresses the in-band noise and reduces both design complexity and power consumption. The bondwire accelerometer is fabricated in a 0.18 mu m CMOS process, achieves a 33 mV/g linear transducer gain within a 5 kHz bandwidth, and consumes 9 mW.
引用
收藏
页码:470 / 473
页数:4
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