Structural morphology and magnetism of electroless-plated NiP films on a surface-modified Si substrate

被引:6
|
作者
Huang, Chun-Chao [1 ]
Hsu, Hao-Chun [1 ]
Tseng, Yuan-Chieh [1 ]
机构
[1] Natl Chiao Tung Univ, Dept Mat Sci & Engn, Hsinchu 30010, Taiwan
关键词
Electroless-plating; Nickel-phosphorus alloy; Anisotropy; Structural morphology; Transmission electron microscopy; Atomic force microscopy; Magnetic properties; NI/GLASS THIN-FILMS; P ALLOYS; SILICON; FABRICATION; DEPOSITION; RESISTANCE; NI/CU;
D O I
10.1016/j.tsf.2011.09.025
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
NiP thin films were deposited on an H(3)PO(4)-etched Si substrate by means of electroless-plating. By varying the plating time, we were able to deposit NiP films with various thicknesses. Thickness effects upon the structural morphology and magnetic properties of the NiP films were investigated, and they can be comprehended with a model of the deposition mechanism. The results demonstrate that the etched Si surface contained groove-like microstructure which shaped the columnar structure inside the NiP films and favored the film deposition; this was hard to achieve with a smooth-surfaced Si substrate. The well-developed columnar structure resulted in a perpendicular anisotropy due to its vertical nature, which can become superior to the film's longitudinal anisotropy if the applied field is sufficient. (C) 2011 Elsevier B.V. All rights reserved.
引用
收藏
页码:1102 / 1108
页数:7
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