A multiscale modeling method for the creep behavior of snag solder alloys

被引：0
|
作者：
Pei, Min [1 ]
Ou, Jianmin [1 ]
机构：
[1] Georgia Inst Technol, Atlanta, GA 30332 USA
来源：
IPACK 2007: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2007, VOL 2 | 2007年
关键词：
D O I：
暂无
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
In this paper, a microstructure-dependent creep model is developed that accounts for the hierarchal microstructure at multiple length scales. The model considers three distinguishable phases in the solder alloy at two different length scales: at the larger scale Sn dendrites of micrometer size are embedded in a homogeneous eutectic phase; at a much smaller length scale the eutectic phase consists of sub-micron size Ag3Sn particles embedded in a homogeneous Sn matrix. The model predictions agree well with creep test data of RE doped SnAg solders.
引用
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页码：115 / 120
页数：6
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