The Analysis of 10 Gbps High-Speed Channel of Aerospace Remote Sensing Camera Based on Signal Integrity

被引:0
|
作者
Su Hao-hang [1 ]
Yan Jing-chun [1 ]
机构
[1] Beijing Inst Space Mech & Elect, Key Lab Opt Remote Sensor Technol CAST, Beijing 100094, Peoples R China
来源
2020 INTERNATIONAL CONFERENCE ON MICROWAVE AND MILLIMETER WAVE TECHNOLOGY (ICMMT 2020 ONLINE) | 2020年
关键词
high-speed serial channel; photoelectric links; signal integrity; eye diagram;
D O I
10.1109/ICMMT49418.2020.9386757
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
With the system's frequency climbing, the final imaging quality has been affected by signal integrity problems of the high-speed link, which becomes a bottleneck of restricting the performance of the remote sensing camera system. In this paper, the design of high-speed photoelectric links between PCB in the electronic design of a space remote sensing camera has been taken as an example. The analysis of inter-board photoelectric interconnect links has been proposed, and the signal integrity simulation has been analyzed in the time domain and the frequency domain based on 3D electromagnetic models of high-speed serial links. Compared with the measure data, the eye diagram of simulation results was highly closed to the measured results, the relative error of eye height was 7.3%, and the error of eye width was 11.4%. The analysis method proposed in this paper could effectively predict attenuation and distortion of signal in high-speed serial links, and which could extensively to analysis the signal integrity of the inter-board photoelectric high-speed links.
引用
收藏
页数:3
相关论文
共 50 条
  • [31] HIGH-SPEED SPECTRORADIOMETER FOR REMOTE-SENSING
    MIYAZAKI, T
    SHIMIZU, H
    YASUOKA, Y
    APPLIED OPTICS, 1987, 26 (22) : 4761 - 4766
  • [32] Signal Integrity Characterization of High-Speed DDR Interface
    Kato, Takuya
    Yamamoto, Shintaro
    Sudo, Toshio
    Ono, Yasushi
    Takahashi, Eiji
    Yamada, Toru
    2011 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS), 2011,
  • [33] CLOCK AND SIGNAL INTEGRITY FOR TESTING HIGH-SPEED ADCS
    Okawara, Hideo
    ELECTRONICS WORLD, 2011, 117 (1908): : 14 - 17
  • [34] High-Speed Signal Integrity Design for HDCA Systems
    Kwon, Wonok
    Kim, Young Woo
    2018 INTERNATIONAL CONFERENCE ON INFORMATION AND COMMUNICATION TECHNOLOGY CONVERGENCE (ICTC), 2018, : 1267 - 1269
  • [35] Signal Integrity Analysis of DDR3 High-Speed Memory Module
    Chen, Cheng-Kuan
    Guo, Wei-Da
    Yu, Chun-Huang
    Wuo, Ruey-Beei
    IEEE EDAPS: 2008 ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM, 2008, : 101 - +
  • [36] Design and signal-integrity analysis of a backplane for high-speed digital systems
    Zhang, H
    Hong, W
    Wang, YQ
    Wang, W
    Hu, JS
    Wang, HM
    Yang, GQ
    Zhang, NZ
    Cui, TJ
    MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2005, 45 (03) : 194 - 199
  • [37] Modeling, Verification, and Signal Integrity Analysis of High-Speed Signaling Channel with Tabbed Routing in High Performance Computing Server Board
    Song, Kyunghwan
    Kim, Jongwook
    Kim, Hyunwoong
    Lee, Seonghi
    Ahn, Jangyong
    Brito, Andres
    Kim, Hyunsik
    Park, Minho
    Ahn, Seungyoung
    ELECTRONICS, 2021, 10 (13)
  • [38] Signal Integrity Analysis of High-Speed Single-Ended and Differential Vias
    Shen, Zuwei
    Tong, Jian
    EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3, 2008, : 65 - +
  • [39] TOOLS PROVIDE EMI AND SIGNAL-INTEGRITY ANALYSIS FOR HIGH-SPEED DESIGNS
    DONLIN, M
    COMPUTER DESIGN, 1994, 33 (05): : 100 - 100
  • [40] Energy-Aware Signal Integrity Analysis for High-Speed PCB Links
    Mueller, Sebastian
    Reuschel, Torsten
    Rimolo-Donadio, Renato
    Kwark, Young H.
    Bruens, Heinz-Dietrich
    Schuster, Christian
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2015, 57 (05) : 1226 - 1234