Fabrication and heat transfer characteristics of C/SiC pyramidal core lattice sandwich panel

被引：64

作者：

Wei, Kai ^{[1
]}

He, Rujie ^{[1
]}

Cheng, Xiangmeng ^{[1
]}

Pei, Yongmao ^{[1
]}

Zhang, Rubing ^{[2
]}

Fang, Daining ^{[1
]}

机构：

[1] Peking Univ, Coll Engn, State Key Lab Turbulence & Complex Syst, Beijing 100871, Peoples R China

[2] Beijing jiaotong Univ, Sch Civil Engn, Dept Mech, Beijing 100044, Peoples R China

来源：

APPLIED THERMAL ENGINEERING | 2015年 / 81卷

基金：

中国国家自然科学基金;

关键词：

C/SiC lattice sandwich panel; Heat transfer; Finite element simulation; Equivalent thermal conductivity; THERMAL-CONDUCTIVITY; FLUID-FLOW; COMPOSITE; EVOLUTION;

D O I：

10.1016/j.applthermaleng.2015.02.012

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

Lightweight C/SiC pyramidal core lattice sandwich panel was proposed and fabricated for potential applications as hot structure and thermal protection system (TPS). The heat transfer characteristics of C/SiC lattice sandwich panel were measured from 600 to 1150 degrees C through an aerodynamic heating simulation experimental system. Temperature distribution on the back surface of the lattice sandwich panel was obtained through periodical thermocouple assignment. Heat insulation effects under different temperatures were also investigated. Finally, a three dimensional finite element simulation model was built to calculate the heat transfer of the C/SiC lattice sandwich panel. The equivalent thermal conductivity of the C/SiC lattice sandwich panel varied from 1.98 to 4.95 W/(m degrees C) when the front surface temperature increased from 600 to 1150 degrees C. It is believed that these results can provide a foundational understanding on the heat transfer characteristics of C/SiC lattice sandwich panel. (C) 2015 Elsevier Ltd. All rights reserved.

引用

页码：10 / 17

页数：8

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