An adaptation of a high-temperature loading device for scanning electron microscopy as supported by finite element modelling

The fact that it is possible to directly trace timed materials science related processes in the SEM with no need to interrupt the variety of loads ("in-situ examinations") by means of a high-temperature loading device opens up new horizons for the more profound comprehension of the phenomena of materials. This article aims at conceiving a suitable sample geometry with regard to temperature and stress distributions with a support by finite element modelling. The comprehension gained for the different interactions between the loading device and the scanning electron microscope forms an important basis here to further optimize the performance of tests. Currently, it is possible to examine kinetic processes on specific samples at temperatures up to 650° C and under a tensile and compression load which theoretically is up to 10.000 N. In addition, a simulation is possible for any stress and temperature profile via a fully digitized microprocessor control. The loading device allows to make short-time creep tests while continuously measuring strains and studying the structure of the surfaces at a constant and freely selectable temperature. A short-time creep test, when performed, is intended to prepare future in-situ damage examinations at 9-12% Cr steels here.