Developing new joining materials for low-temperature electronics assembly

被引：0
|
作者：
Roumanille, P. [1 ,2 ]
Baco, V. [3 ]
Bonningue, C. [3 ]
Gougeon, M. [3 ]
Tailhades, P. [3 ]
Monfraix, P. [1 ]
机构：
[1] IRT St Exupery, Toulouse, France
[2] Uniyersite Toulouse, CIRIMAT, CNRS, INPT UPS, Toulouse, France
[3] CIRIMAT, Toulouse, France
来源：
2016 IEEE NANOTECHNOLOGY MATERIALS AND DEVICES CONFERENCE (NMDC) | 2016年
关键词：
SOLDERS;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页数：2
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