Under glass transition temperature diffusion bonding of bulk metallic glass and aluminum

Under glass transition temperature (Tg < 713 K), diffusion bonding of copper-based bulk metallic glass (BMG) to crystalline Aluminum is performed to prevent the crystallization of BMG and also maintaining the dimensional accuracy. By implementing the electron microscopy characterization and thermodynamic calculations, the bonding mechanism in terms of the elemental solid-state diffusion is modeled based on dissolution and precipitation of surface oxide films at the interface. Under the heightened conditions of diffusion bonding at 10 K below than Tg for 1-h dwell time, a dissimilar sound weldment with a superior joint shear strength ratio of -40% rather than the weakest part (Al) attained.