Fuzzy process control of integrated circuit wire bonding

被引：0
|
作者：
Kinnaird, C
Khotanzad, A
机构：
来源：
1997 ANNUAL MEETING OF THE NORTH AMERICAN FUZZY INFORMATION PROCESSING SOCIETY - NAFIPS | 1997年
关键词：
D O I：
10.1109/NAFIPS.1997.624016
中图分类号：
TP18 [人工智能理论];
学科分类号：
081104 ; 0812 ; 0835 ; 1405 ;
摘要：
This paper describes a fuzzy logic controller which sets parameters for the wire bonding process, specifically, controlling bonded ball size and shear strength density. The design of the fuzzy engine and the development of rules based on operator experience are discussed. The controller has been tested on actual devices; results show improved process control.
引用
收藏
页码：84 / 89
页数：6
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