Fuzzy process control of integrated circuit wire bonding

被引：0
|
作者：
Kinnaird, C
Khotanzad, A
机构：
来源：
1997 ANNUAL MEETING OF THE NORTH AMERICAN FUZZY INFORMATION PROCESSING SOCIETY - NAFIPS | 1997年
关键词：
D O I：
10.1109/NAFIPS.1997.624016
中图分类号：
TP18 [人工智能理论];
学科分类号：
081104 ; 0812 ; 0835 ; 1405 ;
摘要：
This paper describes a fuzzy logic controller which sets parameters for the wire bonding process, specifically, controlling bonded ball size and shear strength density. The design of the fuzzy engine and the development of rules based on operator experience are discussed. The controller has been tested on actual devices; results show improved process control.
引用
收藏
页码：84 / 89
页数：6
相关论文
共 50 条
  • [1] Adaptive fuzzy process control of integrated circuit wire bonding
    IEEE
    不详
    不详
    IEEE Trans. Electron. Packag. Manuf., 3 (233-243):
  • [2] Wire bonding process control using fuzzy logic
    Kinnaird, C
    Khotanzad, A
    1997 IEEE INTERNATIONAL SYMPOSIUM ON SEMICONDUCTOR MANUFACTURING CONFERENCE PROCEEDINGS, 1997, : B63 - B66
  • [3] An adaptive diagnosis system for copper wire bonding process control and quality assessment in integrated circuit assembly
    Tsai, Tsung-Nan
    INTERNATIONAL JOURNAL OF COMPUTER INTEGRATED MANUFACTURING, 2013, 26 (06) : 513 - 526
  • [4] BONDING WIRE DISCHARGES IN INTEGRATED-CIRCUIT PACKAGES
    CROCKETT, RGM
    HUGHES, JF
    PUDE, JRG
    SNO, HM
    JOURNAL OF ELECTROSTATICS, 1985, 16 (2-3) : 343 - 352
  • [5] Fuzzy PID Control for Impact Force of High Speed Wire Bonding Process
    Gao, Jian
    Dai, Guanhao
    Jiang, Yongjun
    Wang, Xiaochu
    Chen, Yun
    Tang, Hui
    He, Yunbo
    2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016, : 47 - 52
  • [6] FULLY AUTOMATED INTEGRATED CIRCUIT WIRE BONDING SYSTEM.
    Naruse, Masayuki
    Miyazaki, Susumu
    Yamada, Tatsuru
    Kawata, Kouichi
    Sakagawa, Yasuo
    Igarashi, Ken-ichi
    NEC Research and Development, 1980, (56): : 163 - 169
  • [7] DEVELOPMENT OF A NEW WIRE BONDING TECHNOLOGY ON INTEGRATED CIRCUIT DEVICES
    Jiang, Yingwei
    Sun, Ronglu
    Wang, Sonder
    Zhang, C. L.
    Yu, Youmin
    Chen, Weimin
    Wei, Xiao
    IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 1, 2010, : 1 - 7
  • [8] FULLY AUTOMATED INTEGRATED-CIRCUIT WIRE BONDING SYSTEM
    NARUSE, M
    MIYAZAKI, S
    YAMADA, T
    KAWATA, K
    SAKAGAWA, Y
    IGARASHI, K
    NEC RESEARCH & DEVELOPMENT, 1980, (56): : 163 - 169
  • [9] Sensors for automatic process control of wire bonding
    Or, SW
    Chan, HLW
    Lo, VC
    Yuen, CWM
    ISAF '96 - PROCEEDINGS OF THE TENTH IEEE INTERNATIONAL SYMPOSIUM ON APPLICATIONS OF FERROELECTRICS, VOLS 1 AND 2, 1996, : 991 - 994
  • [10] Sensors for ultrasonic wire bonding process control
    Chiu, SS
    Chan, HLW
    Or, SW
    Cheung, YM
    Yuen, CWM
    Liu, PCK
    FERROELECTRICS, 1999, 232 (1-4) : 1091 - 1096
12345