Effects of power cycling test condition and test strategy on lifetime estimation of power modules in power electronic systems

被引：7
|
作者：
Choi, U. M. [1 ]
Lee, J. S. [2 ]
Blaabjerg, F. [3 ]
机构：
[1] Seoul Natl Univ Sci & Technol, Dept Elect & IT Media Engn, Seoul, South Korea
[2] Korea Railrd Res Inst, Uiwang, South Korea
[3] Aalborg Univ, Dept Energy Technol, Aalborg, Denmark
来源：
MICROELECTRONICS RELIABILITY | 2019年 / 100卷
基金：
新加坡国家研究基金会;
关键词：
RELIABILITY;
D O I：
10.1016/j.microrel.2019.113460
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
One of the main purposes of an accelerated power cycling test is to develop a lifetime model for the lifetime prediction of power modules. It is important to select proper test conditions when the power cycling test is performed since it is closely related to the lifetime model parameters and also to the testing time. In this paper, the effects of power cycling test condition and test strategy on the lifetime estimation of power modules are studied. The lifetime models of the IGBT module are developed by the accelerated power cycling tests with different test conditions and also by calibrated accelerated power cycling test. As a case study, the lifetime of IGBT module in motor drive system is estimated with different lifetime models and the results are compared.
引用
收藏
页数：6
相关论文
共 50 条
  • [21] Test Methodologies for Power Cycling Experiment
    Sinha, K.
    Al-Bassyiouni, M.
    Hansen, P.
    Dasgupta, A.
    McCluskey, P.
    Beaupre, R.
    Jacobsen, J.
    IMCE2009: PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, VOL 5, 2010, : 35 - 44
  • [22] Power cycling fatigue and lifetime prediction of power electronic devices in space applications
    Vacher, F.
    Calvet, B.
    Mialhe, F.
    MICROELECTRONICS RELIABILITY, 2011, 51 (9-11) : 1985 - 1989
  • [23] Test Bench for Thermal Cycling of 10 kV Silicon Carbide Power Modules
    Sonderskov, S. D.
    Jorgensen, A. B.
    Maarbjerg, A. E.
    Frederiksen, K. L.
    Munk-Nielsen, S.
    Beczkowski, S.
    Uhrenfeldt, C.
    2016 18TH EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS (EPE'16 ECCE EUROPE), 2016,
  • [24] Aging investigation of the latest standard dual power modules using improved interconnect technologies by power cycling test
    Zhang, Yi
    Wu, Rui
    Iannuzzo, Francesco
    Wang, Huai
    MICROELECTRONICS RELIABILITY, 2022, 138
  • [25] Design of the Temperature Field Test System of Power Electronic Packaging Modules
    Hua, Jun
    Jin, Pengyun
    Zheng, Libing
    Fang, Huachao
    Wang, Chunlei
    Han, Li
    Song, Ping
    MATERIALS RESEARCH AND APPLICATIONS, PTS 1-3, 2014, 875-877 : 1929 - +
  • [26] Estimation of the lifetime consumption of power semiconductors due to power cycling in a photovoltaic inverter
    Gruber, Artjom
    Rigbers, Klaus
    2016 18TH EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS (EPE'16 ECCE EUROPE), 2016,
  • [27] On estimation of linkage test power
    Ginsburg, EK
    Axenovich, TI
    Goodman, DW
    GENETIC EPIDEMIOLOGY, 1996, 13 (04) : 355 - 365
  • [28] Effects of Power Tracking Algorithms on Lifetime of Power Electronic Devices Used in Solar Systems
    Batunlu, Canras
    Alrweq, Mohamad
    Albarbar, Alhussein
    ENERGIES, 2016, 9 (11)
  • [29] Power cycling reliability of IGBT power modules
    Sankaran, VA
    Chen, C
    Avant, CS
    Xu, X
    IAS '97 - CONFERENCE RECORD OF THE 1997 IEEE INDUSTRY APPLICATIONS CONFERENCE / THIRTY-SECOND IAS ANNUAL MEETING, VOLS 1-3, 1997, : 1222 - 1227
  • [30] Comparison of a Power Cycling Test using Repetitive Unclamped Inductive Switching for Heat Generation with the DC Power Cycling Test
    Abuogo, James
    Schwabe, Christian
    Lutz, Josef
    Basler, Thomas
    2023 25TH EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS, EPE'23 ECCE EUROPE, 2023,
12345