Fabrication of an LCD light guide plate using closed-die hot embossing

被引:32
|
作者
Wu, Cheng-Hsien [1 ]
Lu, Chien-Hung [2 ]
机构
[1] Natl Kaohsiung Univ Appl Sci, Dept Mol & Die Engn, Kaohsiung 807, Taiwan
[2] Da Yeh Univ, Dept Mech & Automat Engn, Changhua, Taiwan
关键词
D O I
10.1088/0960-1317/18/3/035006
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Hot embossing is currently applied to replicate microstructures only on one side or two opposite sides of a polymer substrate. If microstructure replication on two perpendicular sides of the substrate is necessary, closed-die hot embossing can be applied. In this study, polymethyl methacrylate (PMMA) was used as the polymer substrate. A closed die with three mold inserts was used to compress a heated PMMA substrate. Effects of related process parameters on the replication accuracy were studied. Closed-die hot embossing was compared with injection molding and injection compression molding. Results show that closed-die hot embossing can provide better replication accuracy. Optical anisotropy induced by the molding-related stresses can also be reduced.
引用
收藏
页数:9
相关论文
共 50 条
  • [21] CLOSED-DIE FORGING ANALYSIS OF POLYCARBONATE USING AN UPPER BOUND APPROACH
    FOX, R
    LEE, D
    INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 1989, 31 (04) : 265 - +
  • [22] Fabrication of UV range light guide plate
    Yuta Okayama
    Kenji Yamashita
    Yoshitaka Sawa
    Daiji Noda
    Tadashi Hattori
    Microsystem Technologies, 2010, 16 : 1625 - 1631
  • [23] Fabrication of UV range light guide plate
    Okayama, Yuta
    Yamashita, Kenji
    Sawa, Yoshitaka
    Noda, Daiji
    Hattori, Tadashi
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2010, 16 (8-9): : 1625 - 1631
  • [24] Fabrication of Glass Microlens Array Using Contactless Hot Embossing
    Fouzy, Raja Murfiqah Binti Raja Mohamad
    Yasman, Norfazilasari Binti
    Maharon, Aina Aishah Binti
    Shian, Helen Lee May
    Zawawi, Mohd Zairulnizam Mohd
    INTELLIGENT MANUFACTURING AND MECHATRONICS, SIMM 2023, 2024, : 477 - 485
  • [25] Fabrication of Chalcogenide Microlens Array Using Hot Embossing Method
    Xiong, Hao
    Wang, Zheyao
    2018 IEEE SENSORS, 2018, : 871 - 873
  • [26] Direct stamp fabrication for NIL and hot embossing using HSQ
    Gadegaard, N.
    McCloy, D.
    MICROELECTRONIC ENGINEERING, 2007, 84 (12) : 2785 - 2789
  • [27] Fabrication of optical waveguides in thermosetting polymers using hot embossing
    Choi, CG
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2004, 14 (07) : 945 - 949
  • [28] Fabrication of microneedle array using LIGA and hot embossing process
    Moon, SJ
    Lee, SS
    Lee, HS
    Kwon, TH
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2005, 11 (4-5): : 311 - 318
  • [29] Fabrication of microneedle array using LIGA and hot embossing process
    Sang Jun Moon
    Seung S. Lee
    H. S. Lee
    T. H. Kwon
    Microsystem Technologies, 2005, 11 : 311 - 318
  • [30] Manufacturing of Steel-reinforced Aluminum Products by Combining Hot Extrusion and Closed-Die Forging
    Foydl, Annika
    Pfeiffer, Insa
    Kammler, Matthias
    Pietzka, Daniel
    Matthias, Thorsten
    Jaeger, Andreas
    Tekkaya, A. Erman
    Behrens, Bernd-Arno
    MATERIAL FORMING - ESAFORM 2012, PTS 1 & 2, 2012, 504-506 : 481 - +