Fabrication of an LCD light guide plate using closed-die hot embossing

被引：32

作者：

Wu, Cheng-Hsien ^{[1
]}

Lu, Chien-Hung ^{[2
]}

机构：

[1] Natl Kaohsiung Univ Appl Sci, Dept Mol & Die Engn, Kaohsiung 807, Taiwan

[2] Da Yeh Univ, Dept Mech & Automat Engn, Changhua, Taiwan

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2008年 / 18卷 / 03期

关键词：

D O I：

10.1088/0960-1317/18/3/035006

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Hot embossing is currently applied to replicate microstructures only on one side or two opposite sides of a polymer substrate. If microstructure replication on two perpendicular sides of the substrate is necessary, closed-die hot embossing can be applied. In this study, polymethyl methacrylate (PMMA) was used as the polymer substrate. A closed die with three mold inserts was used to compress a heated PMMA substrate. Effects of related process parameters on the replication accuracy were studied. Closed-die hot embossing was compared with injection molding and injection compression molding. Results show that closed-die hot embossing can provide better replication accuracy. Optical anisotropy induced by the molding-related stresses can also be reduced.

引用

页数：9

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