Multi-walled carbon nanotube/nanocrystalline copper nanocomposite film as an interconnect material

We fabricated nanocomposite films comprising multi-walled carbon nanotubes (MWCNTs, diameter 10 similar to 40 nm, length > 1 mu m) and nanocrystalline copper using a low cost electrochemical method. Owing to pulse deposition with several additives, MWCNTs were well-dispersed in the films through thickness and the nanocomposite films showed a dense structure without any voids. For the purpose of evaluation as a candidate for electronic interconnection, elastic modulus, hardness, electrical resistivity, and thermal conductivity of MWCNT/Cu nanocomposite films were measured using nanoindentation, four probe, and time-domain thermo-reflectance methods. It was found that the mechanical properties were more or less enhanced due to the addition of MWCNTs but electrical and thermal conductivities of nanocomposite films were drastically, decreased. Further studies are needed for the application of electroplated MWCNT/Cu nanocomposite films as next generation interconnecting materials of electronic devices.