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- [2] Comparison of glycine and citric acid as complexing agents in copper chemical-mechanical polishing slurries CHEMICAL-MECHANICAL PLANARIZATION, 2003, 767 : 279 - 284
- [4] Copper dissolution and chemical-mechanical polishing in acidic media INTERCONNECT AND CONTACT METALLIZATION, 1998, 97 (31): : 73 - 83
- [7] A study on the stress and nonuniformity of the wafer surface for the chemical-mechanical polishing process Lin, Y.-Y. (loulin@ms17.hinet.net), 1600, Springer-Verlag London Ltd (22): : 5 - 6
- [8] A study on the stress and nonuniformity of the wafer surface for the chemical-mechanical polishing process The International Journal of Advanced Manufacturing Technology, 2003, 22 : 401 - 409
- [9] A study on the stress and nonuniformity of the wafer surface for the chemical-mechanical polishing process INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2003, 22 (5-6): : 401 - 409
- [10] Study of Optimal Dummy Fill Modes in Chemical-Mechanical Polishing Process IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2012, 2 (06): : 1043 - 1047