Thermal impedance spectroscopy of power modules

被引：32
|
作者：
Hensler, A. [1 ]
Wingert, D. [1 ]
Herold, Ch. [1 ]
Lutz, J. [1 ]
Thoben, M. [2 ]
机构：
[1] Tech Univ Chemnitz, Chemnitz, Germany
[2] Infineon Technol AG, Warstein, Germany
来源：
MICROELECTRONICS RELIABILITY | 2011年 / 51卷 / 9-11期
关键词：
D O I：
10.1016/j.microrel.2011.06.039
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, a method of thermal impedance spectroscopy for power modules is presented. This method enables a high resolution non-destructive analysis of the power module by means of electrical measurement and subsequent mathematical evaluation. The result provides a separation of partial thermal resistances corresponding material layers and facilitates a plausible estimation of geometrical dimensions of the power module package within the heat flow path. This method is applied for localization of failures during power cycling test. (C) 2011 Elsevier Ltd. All rights reserved.
引用
收藏
页码：1679 / 1683
页数：5
相关论文
共 50 条
  • [21] Complex thermal analysis of supercapacitor by thermal impedance spectroscopy
    Li, Zetao
    Mei, Bing-Ang
    THERMOCHIMICA ACTA, 2022, 710
  • [22] Impedance Spectroscopy as On-Field Monitoring Technique for PV modules
    De Riso, Monica
    Matacena, Ilaria
    Guerriero, Pierluigi
    Daliento, Santolo
    2024 19TH CONFERENCE ON PH.D RESEARCH IN MICROELECTRONICS AND ELECTRONICS, PRIME 2024, 2024,
  • [23] Impedance Spectroscopy for Diagnosis of Photovoltaic Modules Under Outdoor Conditions
    Guejia-Burbano, Rudy Alexis
    Petrone, Giovanni
    Piliougine, Michel
    IEEE JOURNAL OF PHOTOVOLTAICS, 2022, 12 (06): : 1503 - 1512
  • [24] Fault Diagnosis of Photovoltaic Modules Using AC Impedance Spectroscopy
    Osawa, Suguru
    Nakano, Takuma
    Matsumoto, Shunya
    Katayama, Noboru
    Saka, Yusuke
    Sato, Hiroki
    2016 IEEE INTERNATIONAL CONFERENCE ON RENEWABLE ENERGY RESEARCH AND APPLICATIONS (ICRERA), 2016, : 210 - 215
  • [25] A Power Saving Protocol for Impedance Spectroscopy
    Birlea, Nicolae Marius
    11TH INTERNATIONAL CONFERENCE OF PROCESSES IN ISOTOPES AND MOLECULES (PIM 2017), 2017, 1917
  • [26] Thermal characterization of IGBT power modules
    Cova, P
    Ciappa, M
    Franceschini, G
    Malberti, P
    Fantini, F
    MICROELECTRONICS AND RELIABILITY, 1997, 37 (10-11): : 1731 - 1734
  • [27] Thermal Power Envelope for IoT Modules
    Shipman, Jared A.
    Chigullapalli, Sruti
    Mata, Jose
    Martin, Thomas A.
    2017 THIRTY-THIRD ANNUAL SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM (SEMI-THERM), 2017, : 95 - 99
  • [28] Evaluation of thermal couple impedance model of power modules for accurate die temperature estimation up to 200 °C
    Nakamura, Yohei
    Kuroda, Naotaka
    Nakahara, Ken
    Shintani, Michihiro
    Sato, Takashi
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2022, 61 (SC)
  • [29] Quantification of cracked area in thermal path of high-power multi-chip modules using transient thermal impedance measurement
    Eleffendi, Mohd. Amir
    Yang, Li
    Agyakwa, Pearl
    Johnson, C. Mark
    MICROELECTRONICS RELIABILITY, 2016, 59 : 73 - 83
  • [30] Thermal Model for Power Converters Based on Thermal Impedance
    Xu, Yang
    Chen, Hao
    Lv, Sen
    Huang, Feifei
    Hu, Zhentao
    JOURNAL OF POWER ELECTRONICS, 2013, 13 (06) : 1080 - 1089
12345