Intra-chip optical interconnects based on a wavelength multiplexed two layer structure

被引:0
|
作者
Yin, SZ [1 ]
机构
[1] Penn State Univ, Dept Elect Engn, University Pk, PA 16802 USA
关键词
optical adaptive processor; multi-channel acousto-optic cells; wideband RF signal processing;
D O I
10.1117/12.326851
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
In this paper, a design on intra-chip optical interconnects based on a wavelength multiplexed two layer structure is presented. The key to this approach is the use of one planar waveguide covering the whole multi chip module and its use of unique tunable diffractive optics elements (DOE). In the bottom layer, there are multiple modules. In each module, there is a light receiver (e.g., a pin photodiode) to receive the clock signal and another to receive information from other individual processing units (IPUs). There is also a light emitter (e.g., a tiny polymer LED) to send information out to other IPUs. The vertical light emitter will send the signal to the upper layer polymer 2-D planar waveguide. To determine which IPUs receive information, a set of fast speed wavelength tunable filters will be fabricated on the polymer waveguide and integrated together with each light source. As a result, we can realize arbitrary reconfigurable interconnects between the entire individual processing units. For example, if the wavelength for the first processing unit is tuned at lambda(2), only the second processing unit can receive this signal because only the second volume holographic grating can diffract wavelength lambda(2), Since all tunable filters can be addressed simultaneously, the whole interconnect system is parallel processing.
引用
收藏
页码:128 / 136
页数:9
相关论文
共 50 条
  • [11] An Inter/Intra-Chip Optical Network for Manycore Processors
    Wu, Xiaowen
    Xu, Jiang
    Ye, Yaoyao
    Wang, Xuan
    Nikdast, Mahdi
    Wang, Zhehui
    Wang, Zhe
    IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2015, 23 (04) : 678 - 691
  • [12] RF Transceiver Circuit Technology Based Wireless Interconnects for Inter- and Intra-Chip Communication System
    Tao, Cheng
    Teemu, Peltonen
    Esa, Tjukanoff
    Tenhunen, Hannu
    EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3, 2008, : 1409 - 1414
  • [13] Ultra-low power silicon photonic transceivers for inter/intra-chip interconnects
    Zheng, Xuezhe
    Cunningham, John E.
    Li, Guoliang
    Luo, Ying
    Thacker, Hiren
    Yao, Jin
    Ho, Ron
    Lexau, Jon
    Liu, Frankie
    Patil, Dinesh
    Amberg, Philip
    Pinckney, Nathaniel
    Dong, Po
    Feng, Dazeng
    Asghari, Mehdi
    Mekis, Attila
    Pinguet, Thierry
    Raj, Kannan
    Krishnamoorthy, Ashok V.
    OPTICS AND PHOTONICS FOR INFORMATION PROCESSING IV, 2010, 7797
  • [14] Enhancement of Intra-chip Transmission between Wireless Interconnects using Artificial Magnetic Conductors
    Narde, Rounak Singh
    Venkataraman, Jayanti
    Ganguly, Amlan
    2018 IEEE ANTENNAS AND PROPAGATION SOCIETY INTERNATIONAL SYMPOSIUM ON ANTENNAS AND PROPAGATION & USNC/URSI NATIONAL RADIO SCIENCE MEETING, 2018, : 805 - 806
  • [15] Intra-chip optical interconnects with compact and low-loss light distribution in silicon-on-insulator rib waveguides
    Cassan, E
    Lardenois, S
    Pascal, D
    Vivien, L
    Heitzmann, M
    Bouzaida, N
    Mollard, L
    Orobtchouk, R
    Laval, S
    PROCEEDINGS OF THE IEEE 2003 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2003, : 39 - 41
  • [16] An intra-chip electro-optical channel based on CMOS single photon detectors
    Sergio, M
    Charbon, E
    IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2005, TECHNICAL DIGEST, 2005, : 837 - 840
  • [17] A One-Hot Encoding Approach for Signal Integrity Enhancement of Intra-chip Interconnects
    Sun, Bo
    Wu, Junxian
    Guo, Chunbing
    Chen, Ken
    2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2024,
  • [18] Intra-chip optical interconnection based on polarization division multiplexing photonic integrated circuit
    Yu, Yu
    Chen, Guanyu
    Sima, Chaotan
    Zhang, Xinliang
    OPTICS EXPRESS, 2017, 25 (23): : 28330 - 28336
  • [19] Wavelength-Multiplexed Duplex Transceiver Based on III-V/Si Hybrid Integration for Off-Chip and On-Chip Optical Interconnects
    Chen, Kaixuan
    Huang, Qiangsheng
    Zhang, Jianhao
    Cheng, Jianxin
    Fu, Xin
    Zhang, Chenzhao
    Ma, Keqi
    Shi, Yaocheng
    Van Thourhout, Dries
    Roelkens, Gunther
    Liu, Liu
    He, Sailing
    IEEE PHOTONICS JOURNAL, 2016, 8 (01):
  • [20] Inter/Intra-Chip Optical Interconnection Network: Opportunities, Challenges, and Implementations
    Yang, Peng
    Nakamura, Shigeru
    Yashiki, Kenichiro
    Wang, Zhehui
    Duong, Luan H. K.
    Wang, Zhifei
    Chen, Xuanqi
    Nakamura, Yuichi
    Xu, Jiang
    2016 TENTH IEEE/ACM INTERNATIONAL SYMPOSIUM ON NETWORKS-ON-CHIP (NOCS), 2016,