Dynamic Behavior of Breakdown Mechanisms in SiGe HBTs

被引:0
|
作者
Lee, Harrison P. [1 ]
Teng, Jeffrey W. [1 ]
Sepulveda-Ramos, Nelson [1 ]
Cressler, John D. [1 ]
机构
[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
来源
2021 IEEE BICMOS AND COMPOUND SEMICONDUCTOR INTEGRATED CIRCUITS AND TECHNOLOGY SYMPOSIUM (BCICTS) | 2021年
关键词
SiGe HBTs; RF Amplifier; Safe Operating Area; Pulsed Measurement; Thermal Runaway; Impact-Ionization;
D O I
10.1109/BCICTS50416.2021.9682470
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The goal of this work is to present a pulsed-voltage measurement scheme which allows separation of impactionization and self-heating effects in the lead-up to device breakdown in high-speed SiGe HBTs, and demonstrate that it enables probing of the dynamic behavior of the operative breakdown mechanisms. By leveraging pulsed-mode measurements, we show an interesting time-dependence of the dominant operative breakdown mechanism. Investigation of the time-dependence of breakdown will facilitate a better understanding of the dynamics of the RF safe operating area (RF-SOA) of SiGe HBTs, which is critical for extracting maximum performance in SiGe for high-speed circuits.
引用
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页数:4
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