Microstructure and Mechanical Property of (Sn-9Zn0.05Ce)xBi Solder

被引：1
|
作者：
Du, Changhua [1 ]
Luo, Yi [1 ]
Su, Jian [1 ]
Yin, Limeng [2 ]
Li, Zhenkang [1 ]
Liu, Bin [1 ]
机构：
[1] Chongqing Univ Technol, Sch Mat Sci & Engn, Chongqing 400050, Peoples R China
[2] Chongqing Univ Sci & Technol, Sch Met & Mat Engn, Chongqing 401331, Peoples R China
来源：
MANUFACTURING PROCESS TECHNOLOGY, PTS 1-5 | 2011年 / 189-193卷
关键词：
(Sn-9Zn0.05Ce)xBi Solder; Microstructure; Tensile Strength; Hardness; LEAD-FREE SOLDER; ALLOYS;
D O I：
10.4028/www.scientific.net/AMR.189-193.3326
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The (Sn-9Zn0.05Ce)xBi solders with different Bi contents were prepared by a new process. The characteristics of solders about microstructure, tensile strength, elongation and microhardness were studied. The results showed that addition Bi can induce acicular or granular Zn-rich precipitated phase in Sn-9Zn0.05Ce solder. To increasing Bi content caused more Zn-rich phase distributed disorderly. When the Bi content was added to 4%, the granular Bi precipitated phase was observable. The tensile strength and hardness of (Sn-9Zn0.05Ce)xBi solder will raise, but elongation descend significantly due to the Bi content increasing. It can be funded that there was a more obvious turning point as w(Bi)=2wt %.
引用
收藏
页码：3326 / +
页数：2
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