Paradigm Shift in High-Speed Interface Technology

被引:0
|
作者
Muth, K. [1 ]
Raghuraman, V [1 ]
Raghunathan, V [1 ]
机构
[1] Broadcom Inc, 408 East Plumeria Dr, San Jose, CA 95134 USA
来源
OPTICAL INTERCONNECTS XXII | 2022年 / 12007卷
关键词
silicon photonics; interface; density; high speed power-efficient; scaling; heterogeneous integration; terabit;
D O I
10.1117/12.2610977
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
The exponential growth in data center traffic is driving an increase in demand for cost and energy efficient interface bandwidth scaling. This creates a need for a paradigm shift in I/O technology that meets future connectivity requirements within data centers. Silicon Photonics (SiPh) based optical interfaces significantly improve I/O density by optimizing solutions along three vectors: Packaging density, speed per lane, and number of wavelengths per channel. Each vector must be independently optimized. This paper recommends a SiPh based optical I/O platform that merges mature silicon chiplet packaging and fiber connectivity to achieve the highest I/O efficiency for networking applications.
引用
收藏
页数:4
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