Optical Response of 3D Nano-Architecture Solar Cells and Integration with 3D Device Physics

被引:1
|
作者
Wangperawong, Artit [1 ]
Haegglund, Carl [2 ]
Bent, Stacey F. [2 ]
机构
[1] Stanford Univ, Dept Elect Engn, Stanford, CA 94305 USA
[2] Stanford Univ, Dept Chem Engn, Stanford, CA 94305 USA
基金
美国国家科学基金会;
关键词
solar cell; photovoltaics; nanostructure; modeling; simulation; 3D; three dimensional; CdTe;
D O I
10.1117/12.893168
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
We study the optical response of various nanojunction solar cell architectures and examine how various cylindrical arrangements of emitter, base, glass and transparent conductor affect reflection and absorption of incident light. The photogeneration profiles of such nano-architectures are cylindrically asymmetric, varying axially, radially and azimuthally within the wavelength band investigated. Such 3D profiles require 3D device models for accurate device analysis. The extended nanojunction configuration was examined in more detail, as this design is known to have superior performance. The particular design consists of nanostructured glass and a superstrate arrangement of the other device elements.
引用
收藏
页数:8
相关论文
共 50 条
  • [31] FEASIBILITY OF 3D INTEGRATION
    SASAKI, N
    EUROPEAN TRANSACTIONS ON TELECOMMUNICATIONS, 1990, 1 (02): : 137 - 142
  • [32] 3D FOWLP Integration
    Guan, Lim Teck
    Ho, David Soon Wee
    Chong, Chai Tai
    Bhattacharya, Surya
    2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 1728 - 1735
  • [33] Challenges in 3D Integration
    Koyanagi, Mitsumasa
    Lee, Kang Wook
    Fukushima, Takafumi
    Tanaka, Tetsu
    SILICON COMPATIBLE MATERIALS, PROCESSES, AND TECHNOLOGIES FOR ADVANCED INTEGRATED CIRCUITS AND EMERGING APPLICATIONS 3, 2013, 53 (03): : 237 - 244
  • [34] 3D integration review
    Farooq, Mukta G.
    Iyer, Subramanian S.
    SCIENCE CHINA-INFORMATION SCIENCES, 2011, 54 (05) : 1012 - 1025
  • [35] 3D Integration Technologies
    Ramm, Peter
    Klumpp, Armin
    Weber, Josef
    Taklo, Maaike M. V.
    DTIP 2009: SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS, 2009, : 71 - +
  • [36] Metrology for 3D Integration
    Allen, Richard A.
    Vartanian, Victor H.
    Read, David
    Baylies, Winthrop A.
    INTERNATIONAL SYMPOSIUM ON FUNCTIONAL DIVERSIFICATION OF SEMICONDUCTOR ELECTRONICS 2 (MORE-THAN-MOORE 2), 2014, 61 (06): : 105 - 112
  • [37] 3D monolithic integration
    Batude, P.
    Vinet, M.
    Pouydebasque, A.
    Le Royer, C.
    Previtali, B.
    Tabone, C.
    Hartmann, J. -M.
    Sanchez, L.
    Baud, L.
    Carron, V.
    Toffoli, A.
    Allain, F.
    Mazzocchi, V.
    Lafond, D.
    Deleonibus, S.
    Faynot, O.
    2011 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS), 2011, : 2233 - 2236
  • [38] 3D system integration
    Klumpp, Armin
    Merkel, Reinhard
    Ramm, Peter
    Wieland, Robert
    2007 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATIONS (VLSI-TSA), PROCEEDINGS OF TECHNICAL PAPERS, 2007, : 70 - +
  • [39] 3d integration for introspection
    Mysore, Shashidhar
    Agrawal, Banit
    Srivastava, Navin
    Lin, Sheng-Chih
    Banerjee, Kaustav
    Sherwood, Timothy
    IEEE MICRO, 2007, 27 (01) : 77 - 83
  • [40] Graphein: A Novel Optical High-Radix Switch Architecture for 3D Integration
    Jian, Jie
    Lai, Mingche
    Xiao, Liquan
    Xu, Weixia
    ALGORITHMS AND ARCHITECTURES FOR PARALLEL PROCESSING, ICA3PP 2016, 2016, 10048 : 162 - 177