Grain boundary premelting in plastically deformed bicrystals and polycrystals of some FCC metals

The grain boundary premelting (GBPM) in thin foils of plastically deformed copper and silver bicrystals, and copper, nickel and 70Cu-30Zn brass polycrystals occurs at extremely low temperatures of approximately half of the bulk melting point T-M. The GBPM temperatures Tms in thin foils of bicrystals whose grain boundary planes were parallel to activated screw dislocations was lower than to actived edge dislocations. The GBPM tends to occur along the grain boundaries with the high density of piled-rp dislocations and without full recovery, and/or recrystallization up to T-M.