Lowering curing temperature in adhesive bonding of aluminum AA6061-T4

被引：6

作者：

Li, Yuan ^{[1
]}

Wang, Sheng-nan ^{[1
]}

Guo, Yi-min ^{[1
]}

Cai, Bin ^{[1
]}

Liu, Zhong-Xia ^{[1
]}

Wang, Pei-Chung ^{[2
]}

Fan, Charles ^{[2
]}

机构：

[1] Zhengzhou Univ, Sch Phys & Engn, Key Lab Mat Phys, Zhengzhou, Henan, Peoples R China

[2] Gen Motors Global Res & Dev Ctr, Mfg Syst Res Lab, Warren, MI USA

来源：

JOURNAL OF ADHESION | 2018年 / 94卷 / 11期

关键词：

Epoxy; epoxides; automotive; lap-shear; cure; hardening; aluminum and alloys; LAP-SHEAR-STRENGTH; EPOXY-RESIN; AGENT; BEHAVIOR; JOINTS; ALLOY; STEEL;

D O I：

10.1080/00218464.2017.1377077

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

To minimize the part distortion and investment in the E-coat oven in adhesive bonding of metals for automotive applications, lowering the curing temperature of adhesive without apparent loss of the joint strength is desirable. The key to lower the curing temperature of adhesive bonding of lightweight materials is to accelerate the curing process of structural adhesives. In this study, curing agent (i.e., aliphatic polyamine) and curing accelerator (i.e., acetylacetone salt) were added into commercial Henkel 5089 adhesive and the effect of these curing additives on the curing temperature of Henkel 5089 in adhesive bonding of aluminum AA6061-T4 was studied. The test results showed that the addition of a curing agent and accelerator in Henkel 5089 lowered the curing temperature from 177 degrees C to 130 degrees C without sacrificing the strength of the adhesive-bonded aluminum AA6061-T4.

引用

页码：893 / 909

页数：17

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