How to adapt the electronics packaging teaching process to current needs - A perspective

被引:0
|
作者
Pitica, D [1 ]
Chindris, G [1 ]
机构
[1] Tech Univ Cluj Napoca, Appl Elect Dept, Cluj Napoca, Romania
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The new higher learning educational system divided in three main stages: bachelor, master and doctoral degrees - demands a new approach which must take into consideration the common ground of different higher learning systems, the specific characteristics of pre-university learning system and the local particularities of the regional and national electronic industry's environment. A classification of competencies required for the alumni in every stage of education, illustrating the very means of implementing these competencies at the level of electronic packaging education is proposed. Statistical data results from the training process of 2002-2003 year of study, where the results were obtained by applying the proposed methods without an effective enrolment in the fore coming new educational system are presented.
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页码:20 / 24
页数:5
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