Microscale heat transfer at low temperatures

被引:0
|
作者
Radebaugh, R [1 ]
机构
[1] Natl Inst Stand & Technol, Cryogen Technol Grp, Boulder, CO USA
来源
MICROSCALE HEAT TRANSFER: FUNDAMENTALS AND APPLICATIONS | 2005年 / 193卷
关键词
D O I
暂无
中图分类号
O414.1 [热力学];
学科分类号
摘要
引用
收藏
页码:93 / 124
页数:32
相关论文
共 50 条
  • [21] Heat transfer enhancement by fins in the microscale regime
    Chou, FC
    Lukes, JR
    Tien, CL
    JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 1999, 121 (04): : 972 - 977
  • [22] Special Issue on Nano/Microscale Heat Transfer
    MA Weigang
    LUO Tengfei
    BAO Hua
    MIAO Tingting
    LI Qin-Yi
    JournalofThermalScience, 2022, 31 (04) : 975 - 975
  • [23] CONVECTIVE HEAT TRANSFER IN MICROSCALE SLIP FLOW
    Yazicioglu, A. Guvenc
    Kakac, S.
    MICROFLUIDICS BASED MICROSYSTEMS: FUNDAMENTALS AND APPLICATIONS, 2010, : 15 - +
  • [24] Microscale heat transfer of confined miniature jets
    Glynn, Colin
    Murray, Darina B.
    Robinson, Anthony J.
    Lupton, Thomas L.
    PROCEEDINGS OF THE 4TH INTERNATIONAL CONFERENCE ON NANOCHANNELS, MICROCHANNNELS, AND MINICHANNELS, PTS A AND B, 2006, : 319 - 327
  • [25] Special Issue on Nano/Microscale Heat Transfer
    Qiu, Lin
    APPLIED SCIENCES-BASEL, 2022, 12 (15):
  • [26] Condensation heat transfer in rectangular microscale geometries
    Garimella, Srinivas
    Agarwal, Akhil
    Fronk, Brian M.
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2016, 100 : 98 - 110
  • [27] On heat transfer at microscale with implications for microactuator design
    Ozsun, Ozgur
    Alaca, B. Erdem
    Yalcinkaya, Arda D.
    Yilmaz, Mehmet
    Zervas, Michalis
    Leblebici, Yusuf
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2009, 19 (04)
  • [28] Special Issue on Nano/Microscale Heat Transfer
    Weigang Ma
    Tengfei Luo
    Hua Bao
    Tingting Miao
    Qin-Yi Li
    Journal of Thermal Science, 2022, 31 : 975 - 975
  • [29] Microscale Surface Modifications for Heat Transfer Enhancement
    Bostanci, Huseyin
    Singh, Virendra
    Kizito, John P.
    Rini, Daniel P.
    Seal, Sudipta
    Chow, Louis C.
    ACS APPLIED MATERIALS & INTERFACES, 2013, 5 (19) : 9572 - 9578
  • [30] On Simulation of Heat Transfer at Microscale: A Case Study
    Tibeica, C.
    Voicu, R.
    2017 INTERNATIONAL SEMICONDUCTOR CONFERENCE (CAS), 40TH EDITION, 2017, : 217 - 220