Heterogeneous integration in silicon photonics through micro-transfer-printing

被引:0
|
作者
Zhang, Jing [1 ]
Muliuk, Grigorij [1 ]
Goyvaerts, Jeroen [1 ]
Haq, Bahawal [1 ]
Liles, Alexandros [1 ]
Kumari, Sulakshna [1 ]
Juvert, Joan [1 ]
Op de Beeck, Camiel [1 ]
Kuyken, Bart [1 ]
Van Campenhout, Joris [2 ]
Lepage, Guy [2 ]
Verheyen, Peter [2 ]
Gocalinska, Agnieszka [3 ]
Pelucchi, Emanuele [3 ]
Corbett, Brian [3 ]
Trindade, Antonio Jose [4 ]
Bower, Chris [4 ]
Roelkens, Gunther [1 ]
机构
[1] Univ Ghent, IMEC, Technol Pk Zwijnaarde 126, B-9052 Ghent, Belgium
[2] IMEC, Leuven, Belgium
[3] Tyndall Natl Inst, Cork, Ireland
[4] X Celeprint Ltd, Dublin, Ireland
基金
欧盟地平线“2020”;
关键词
D O I
10.23919/moc46630.2019.8982786
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Micro-transfer-printing enables the intimate integration of a wide range of opto-electronic micro-components on a silicon photonics platform. This technique allows for wafer-scale integration in a massively parallel manner with high alignment accuracy, high throughput and high yield, therefore leading to a cost reduction of complex photonic integrated circuits.
引用
收藏
页码:64 / 65
页数:2
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