Heterogeneous integration in silicon photonics through micro-transfer-printing

被引:0
|
作者
Zhang, Jing [1 ]
Muliuk, Grigorij [1 ]
Goyvaerts, Jeroen [1 ]
Haq, Bahawal [1 ]
Liles, Alexandros [1 ]
Kumari, Sulakshna [1 ]
Juvert, Joan [1 ]
Op de Beeck, Camiel [1 ]
Kuyken, Bart [1 ]
Van Campenhout, Joris [2 ]
Lepage, Guy [2 ]
Verheyen, Peter [2 ]
Gocalinska, Agnieszka [3 ]
Pelucchi, Emanuele [3 ]
Corbett, Brian [3 ]
Trindade, Antonio Jose [4 ]
Bower, Chris [4 ]
Roelkens, Gunther [1 ]
机构
[1] Univ Ghent, IMEC, Technol Pk Zwijnaarde 126, B-9052 Ghent, Belgium
[2] IMEC, Leuven, Belgium
[3] Tyndall Natl Inst, Cork, Ireland
[4] X Celeprint Ltd, Dublin, Ireland
基金
欧盟地平线“2020”;
关键词
D O I
10.23919/moc46630.2019.8982786
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Micro-transfer-printing enables the intimate integration of a wide range of opto-electronic micro-components on a silicon photonics platform. This technique allows for wafer-scale integration in a massively parallel manner with high alignment accuracy, high throughput and high yield, therefore leading to a cost reduction of complex photonic integrated circuits.
引用
收藏
页码:64 / 65
页数:2
相关论文
共 50 条
  • [1] Heterogeneous integration in silicon photonics through micro-transfer-printing
    Zhang, Jing
    Muliuk, Grigorij
    Goyvaerts, Jeroen
    Haq, Bahawal
    Kumari, Sulakshna
    Juvert, Joan
    De Beeck, Camiel Op
    Kuyken, Bart
    Van Campenhout, Joris
    Lepage, Guy
    Verheyen, Peter
    Gocalinska, Agnieszka
    Pelucchi, Emanuele
    Corbett, Brian
    Trindade, Antonio Jose
    Bower, Chris
    Roelkens, Gunther
    MOC 2019 - 24th Microoptics Conference, 2019, : 64 - 65
  • [2] Micro-transfer-printing for heterogeneous integration
    Corbett, B.
    Li, Z.
    Buehler, K.
    Naumann, F.
    Krieger, U.
    Wicht, S.
    Bower, C. A.
    PROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D), 2019, : 34 - 34
  • [3] Micro-transfer-printing of InP Photonic Devices to Silicon Photonics
    Loi, Ruggero
    O'Callaghan, James
    Roycroft, Brendan
    Trindade, Antonio Jose
    Fecioru, Alin
    Farrell, Alex
    Kelleher, Steven
    Gul, Raja Fazan
    Iadanza, Simone
    O'Faolain, Liam
    Pelucchi, Emanuele
    Corbett, Brian
    Gomez, David
    2019 PHOTONICS & ELECTROMAGNETICS RESEARCH SYMPOSIUM - SPRING (PIERS-SPRING), 2019, : 242 - 248
  • [4] Programmable micro-transfer-printing for heterogeneous material integration
    Wang, Yunda
    Solberg, Scott
    Lu, JengPing
    Wang, Qian
    Chang, Norine
    Schwartz, David
    Chintapalli, Mahati
    AIP ADVANCES, 2022, 12 (06)
  • [5] Heterogeneous Integration of Microscale Compound Semiconductor Devices By Micro-Transfer-Printing
    Bower, Christopher A.
    Meitl, Matthew A.
    Bonafede, Salvatore
    Gomez, David
    Fecioru, Alin
    Kneeburg, David
    2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015, : 963 - 967
  • [6] Heterogeneous Integration of Microscale Gallium Nitride Transistors by Micro-Transfer-Printing
    Lerner, Ralf
    Eisenbrandt, Stefan
    Bonafede, Salvatore
    Meitl, Matthew A.
    Fecioru, Alin
    Trindade, Antonio Jose
    Reiner, Richard
    Waltreit, Patrick
    Bower, Christopher A.
    2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2016, : 1186 - 1189
  • [7] Micro-Transfer-Printing - A unique technology for heterogeneous integration of (opto-) electronic components
    Kittler, Gabriel
    49TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE (ESSDERC 2019), 2019, : 47 - 49
  • [8] Micro-Transfer-Printing: Heterogeneous Integration of Microscale Semiconductor Devices using Elastomer Stamps
    Bower, Christopher A.
    Meitl, Matthew
    Kneeburg, David
    2014 IEEE SENSORS, 2014, : 2111 - 2113
  • [9] Heterogeneous Integration of Uni-Travelling-Carrier Photodiodes using Micro-Transfer-Printing on a Silicon-Nitride Platform
    Maes, Dennis
    Roelkens, Gunther
    Zaknoune, Mohammed
    de Beeck, Camiel Op
    Poelman, Stijn
    Billet, Maximilien
    Muneeb, Muhammad
    Lemey, Sam
    Peytavit, Emilien
    Kuyken, Bart
    2021 CONFERENCE ON LASERS AND ELECTRO-OPTICS EUROPE & EUROPEAN QUANTUM ELECTRONICS CONFERENCE (CLEO/EUROPE-EQEC), 2021,
  • [10] Flexible and Scalable Heterogeneous Integration of GaN HEMTs on Si-CMOS by Micro-Transfer-Printing
    Lerner, Ralf
    Eisenbrandt, Stefan
    Fischer, Frank
    Fecioru, Alin
    Trindade, Antonio Jose
    Bonafede, Salvatore
    Bower, Christopher
    Waltereit, Patrick
    Reiner, Richard
    Czap, Heiko
    PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2018, 215 (08):