Modular circuit simulation with integrated applications

被引：0
|
作者：
Zuberek, WM
机构：
[1] Department of Computer Science, Memorial University of Newfoundland, St. John's
来源：
COMPUTERS & ELECTRICAL ENGINEERING | 1996年 / 22卷 / 02期
关键词：
circuit simulation; circuit optimization; parameter extraction; mixed analog-digital simulation; SPICE-PAC simulation package; modular CAD tools; integrated applications;
D O I：
10.1016/0045-7906(95)00037-2
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
A modular approach to circuit simulation is proposed in which the traditional ''closed'' structure of circuit simulators is replaced by a collection of loosely coupled ''simulation primitives'' which can be combined in different ways, depending upon a particular application. An implementation of this approach, the SPICE-PAC simulation package, is described. SPICE-PAC is compatible with the popular SPICE circuit simulator, but it also supports a number of extensions and refinements which are not available in the original SPICE-like programs. Several integrated applications are discussed in greater detail to illustrate the flexibility of the proposed approach.
引用
收藏
页码：85 / 101
页数：17
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