Reliability of solder joint and SMT assembly

被引：0
|
作者：
Sandera, J [1 ]
机构：
[1] Brno Univ Technol, Dept Microelect, Brno, Czech Republic
来源：
2005 Spanish Conference on Electron Devices, Proceedings | 2005年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：73 / 76
页数：4
相关论文
共 50 条
  • [21] Solder joint reliability analysis of a wafer-level CSP assembly with CU studs formed on solder pads
    Chang, KC
    Chiang, KN
    JOURNAL OF THE CHINESE INSTITUTE OF ENGINEERS, 2003, 26 (04) : 467 - 479
  • [22] 3-D Reconstruction for SMT Solder Joint Based on Joint Shadow
    Wang, Lichen
    Zhang, Aimin
    Guo, Chujia
    Zhao, Songyun
    Bhan, Perez
    2015 27TH CHINESE CONTROL AND DECISION CONFERENCE (CCDC), 2015, : 5766 - 5772
  • [23] A highlight processing technology for SMT solder joint gray image
    Liang Tianshou
    Zhou Dejian
    Liu Zhengwei
    2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 898 - 901
  • [24] Fine pitch BGA solder joint split in SMT process
    Chiu, Chun-Chi
    Li, Yun-Tsung
    Li, Hsun-Fa
    Wang, Chuei-Tang
    IMPACT: 2009 4TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE, 2009, : 529 - 532
  • [25] Design of a visual system for predicting SMT solder joint shape
    赵秀娟
    王春青
    郑冠群
    王国忠
    杨士勤
    China Welding, 1999, (01) : 3 - 10
  • [26] Design of a visual system for predicting SMT solder joint shape
    Zhao, Xiujuan
    Wang, Chunqing
    Zheng, Guanqun
    Wang, Guozhong
    Yang, Shiqin
    China Welding (English Edition), 1999, 8 (01): : 1 - 8
  • [27] A study on rupture behavior of SMT solder joint with mechanical heterogeneity
    Wang, L
    Fang, H
    Qian, Y
    Wang, G
    MICRO MATERIALS, PROCEEDINGS, 2000, : 536 - 536
  • [28] Thermal performance and solder joint reliability for board level assembly of modified leadframe package
    Lee, CC
    Lee, CC
    Chiang, KN
    THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS, 2005, : 553 - 558
  • [29] Effect of Solder Joint Parameter on Vibration Fatigue Reliability of High Density PCB Assembly
    Qi, Xueli
    Zhou, Bin
    En, Yunfei
    2011 INTERNATIONAL CONFERENCE ON QUALITY, RELIABILITY, RISK, MAINTENANCE, AND SAFETY ENGINEERING (ICQR2MSE), 2011, : 514 - 517
  • [30] Solder joint attachment reliability and assembly quality of a molded bail grid array socket
    Coyle, RJ
    Holliday, A
    Solan, PP
    Yao, C
    Cyker, HA
    Manock, JC
    Bond, R
    Stenerson, RE
    Furrow, RG
    Occhipinti, MV
    Gahr, SA
    51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 1219 - 1226
12345