Reliability of solder joint and SMT assembly

被引：0
|
作者：
Sandera, J [1 ]
机构：
[1] Brno Univ Technol, Dept Microelect, Brno, Czech Republic
来源：
2005 Spanish Conference on Electron Devices, Proceedings | 2005年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：73 / 76
页数：4
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