The Electrochemical Behaviour during Chemical Mechanical Polishing of Ti in Peroxide Based Alkaline Slurries

被引：0
|
作者：
Liang, Chenliang [1 ,2 ]
Liu, Weili [1 ]
Song, Zhitang [1 ]
机构：
[1] Chinese Acad Sci, State Key Lab Funct Mat Informat, Shanghai Inst Microsyst & Informat Technol, Shanghai, Peoples R China
[2] Chinese Acad Sci, Grad Sch, Beijing 100080, Peoples R China
来源：
2015 INTERNATIONAL CONFERENCE ON PLANARIZATION/CMP TECHNOLOGY (ICPT) | 2015年
关键词：
D O I：
暂无
中图分类号：
TQ [化学工业];
学科分类号：
0817 ;
摘要：
This work presents an electrochemical investigation of chemical reaction kinetics in CMP of Ti in a peroxide-based alkaline medium. Linear polarization scanning (LP) is combined with electrochemical impedance spectroscopy (EIS) to probe the chemical roles of H2O2 and OK in CMP. The equivalent circuit is obtained from EIS and each element is given its meaning to chemical kinetics in CMP process. Factors like the thickness of oxide layer, the mass transfer resistance and the capacitance of the double layer can be gained from the specific values in the equivalent circuit. A gradual oxidizing effect is observed in the chemical reactions, which coincides with the result from x-ray photoelectron spectroscopy (XPS). The results demonstrate how the detailed chemical aspects of the process can be studied by LP and EIS.
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页数：4
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