X-RAY MEASUREMENT OF THE Cu/Ni MULTILAYER PERIOD

Results of the X-ray examination of a Cu/Ni multilayer obtained by the magnetron deposition technique are presented in the article. The multilayer composed of one hundred bilayers was deposited on a Si (100) silicon substrate. The thickness of the Cu sub-layer was 2nm, while the thickness of the Ni sub-layer was greater, being 3nm. The grazing-incidence X-ray diffraction (GXRD) method with X-ray incidence angles ranging from 0.5 to 22.5 degrees was employed for the investigation. The X-ray beam of a wavelength of lambda(Co)=0.17902nm in the diffraction angle range of 2 Theta=43 divided by 63 degrees was used. The obtained diffraction patterns were analyzed for the greatest intensity of the main peaks (111) and (200) and their associated satellite peaks S-1 and S+1. As a result, the total intensity of all peaks as a function of X-ray incidence angle was determined. It was found that the greatest intensity was exhibited by diffraction reflections recorded at X-ray incidence angles in the range of 5 divided by 10 degrees.