Application of atmospheric plasma abatement system for exhausted gas from MEMS etching process

被引：0
|
作者：
Hattori, Kenji [1 ]
Sakurai, Kazuhiko [2 ]
Watanabe, Nobuaki [1 ]
Mangyou, Hirotaka [1 ]
Hasaka, Satoshi [1 ]
Shibuya, Kazunobu [1 ]
机构：
[1] Taiyo Nippon Sanso Corp, Kawasaki Ku, 3-3 Mizue Cho, Kawasaki, Kanagawa 2100866, Japan
[2] OMRON Corp, Kawasaki Ku, Kawasaki, Kanagawa 2100866, Japan
来源：
ISSM 2006 CONFERENCE PROCEEDINGS- 13TH INTERNATIONAL SYMPOSIUM ON SEMICONDUCTOR MANUFACTURING | 2006年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
For the reduction of global warming potential (GWP) gases such as PFCs from semiconductor manufacturing process, we have developed an atmospheric plasma abatement system that has high decomposition efficiency. We have applied the plasma abatement system for decomposition of PFCs in exhausted gas from MEMS (Micro Electro Mechanical System) etching process and have carried out the beta test. We have demonstrated that the plasma abatement system was available for MEMS etching process with high efficiency and durability for reduction of PFCs emission during stable operation.
引用
收藏
页码：39 / +
页数：2
相关论文
共 50 条
  • [41] Model analysis of atmospheric non-thermal plasma for methane abatement in a gas phase dielectric barrier discharge reactor
    Molteni, Matteo
    Donazzi, Alessandro
    CHEMICAL ENGINEERING SCIENCE, 2020, 212
  • [42] Silicon Wafer Surface-Temperature Monitoring System for Plasma Etching Process
    Yamada, Y.
    Ishii, J.
    Nakaoka, A.
    Mizojiri, Y.
    INTERNATIONAL JOURNAL OF THERMOPHYSICS, 2011, 32 (7-8) : 1457 - 1466
  • [43] In-process monitoring of atmospheric pressure plasma jet etching using a confocal laser displacement sensor
    Takeru Tomita
    Kenta Nakazawa
    Takahiro Hiraoka
    Yuichi Otsuka
    Kensuke Nakamura
    Futoshi Iwata
    Microsystem Technologies, 2023, 29 : 1107 - 1116
  • [44] In-process monitoring of atmospheric pressure plasma jet etching using a confocal laser displacement sensor
    Tomita, Takeru
    Nakazawa, Kenta
    Hiraoka, Takahiro
    Otsuka, Yuichi
    Nakamura, Kensuke
    Iwata, Futoshi
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2023, 29 (08): : 1107 - 1116
  • [45] Silicon Wafer Surface-Temperature Monitoring System for Plasma Etching Process
    Y. Yamada
    J. Ishii
    A. Nakaoka
    Y. Mizojiri
    International Journal of Thermophysics, 2011, 32 : 1457 - 1466
  • [46] Abatement of odor pollution from municipal waste by dielectric barrier discharge plasma process
    Chen, Weili
    Ye, Daiqi
    He, Ying
    Progress of Green Oxidation/Reduction Technologies, 2006, : 188 - 191
  • [47] One-step Silicon Substrate Through-wafer Etching Process for High Precision MEMS Application
    Xu, X. C.
    Wu, W. J.
    Liu, H. F.
    Fan, J.
    Liu, J. Q.
    Tu, L. C.
    2017 IEEE 12TH NANOTECHNOLOGY MATERIALS AND DEVICES CONFERENCE (NMDC), 2017, : 121 - 122
  • [48] Treatment Exhaust Gas From Engine by Plasma at Atmospheric Pressure
    Tran Ngoc Dam
    Do Van Dung
    2016 3RD INTERNATIONAL CONFERENCE ON GREEN TECHNOLOGY AND SUSTAINABLE DEVELOPMENT (GTSD), 2016, : 228 - 231
  • [49] Application of argon plasma sheet in the etching process of calcium carbonate crystals for AFM tests
    Moczala, Magdalena
    Karpinska, Miriam
    Poznar, Monika
    Dobryszycki, Piotr
    Sikora, Andrzej
    MATERIALS SCIENCE-POLAND, 2018, 36 (01): : 75 - 79
  • [50] Application of magnetic neutral loop discharge plasma to SiO2 etching process
    Chen, W
    Hayashi, T
    Itoh, M
    Morikawa, Y
    Sugita, K
    Uchida, T
    VACUUM, 1999, 53 (1-2) : 29 - 32
12345