Application of atmospheric plasma abatement system for exhausted gas from MEMS etching process

被引：0

作者：

Hattori, Kenji ^{[1
]}

Sakurai, Kazuhiko ^{[2
]}

Watanabe, Nobuaki ^{[1
]}

Mangyou, Hirotaka ^{[1
]}

Hasaka, Satoshi ^{[1
]}

Shibuya, Kazunobu ^{[1
]}

机构：

[1] Taiyo Nippon Sanso Corp, Kawasaki Ku, 3-3 Mizue Cho, Kawasaki, Kanagawa 2100866, Japan

[2] OMRON Corp, Kawasaki Ku, Kawasaki, Kanagawa 2100866, Japan

来源：

ISSM 2006 CONFERENCE PROCEEDINGS- 13TH INTERNATIONAL SYMPOSIUM ON SEMICONDUCTOR MANUFACTURING | 2006年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

For the reduction of global warming potential (GWP) gases such as PFCs from semiconductor manufacturing process, we have developed an atmospheric plasma abatement system that has high decomposition efficiency. We have applied the plasma abatement system for decomposition of PFCs in exhausted gas from MEMS (Micro Electro Mechanical System) etching process and have carried out the beta test. We have demonstrated that the plasma abatement system was available for MEMS etching process with high efficiency and durability for reduction of PFCs emission during stable operation.

引用

页码：39 / +

页数：2

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