Cu/Sn isothermal solidification technology for hermetic packaging of MEMS

被引：8
|
作者：
Li Li [1 ]
Jiwei Jiao [1 ]
Le Luo [1 ]
Yuelin Wang [1 ]
机构：
[1] Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Labs Transducer Technol, 865 Chang Ning Rd, Shanghai 200050, Peoples R China
来源：
2006 1ST IEEE INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS, VOLS 1-3 | 2006年
关键词：
isothermal solidification (IS); hermetic packaging; MEMS;
D O I：
10.1109/NEMS.2006.334665
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper introduces a novel wafer-level hermetic packaging technology for MEMS based on Cu/Sn isothermal solidification (IS) technology We designed the structure of the intermediate multi-layer and the pattern of sealing rings, optimized the bonding process, and analyzed some key factors affecting the hermeticity, such as the dimension of the sealing rings. Successful Cu/Sn IS bonding was realized at a low bonding temperature of 350 degrees C under the optimal conditions. High shear strength of 27.7MPa and excellent leak rate of around 2 X 10(-9)atm cc/s have been achieved, which meet the requirements of MIL-STD-883E. Finally we designed and manufactured the micro resonator based on the Cu/Sn IS technology.
引用
收藏
页码：1133 / +
页数：2
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