共 50 条
- [41] Simple, reliable Cu/low-k interconnect integration using mechanically-strong low-k dielectric material: Silicon-oxycarbide PROCEEDINGS OF THE IEEE 2000 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2000, : 222 - 224
- [42] Low hydrolysis poly(vinyl alcohol): Advantages in slashing and finishing AATCC 1997 INTERNATIONAL CONFERENCE & EXHIBITION - BOOK OF PAPERS, 1997, : 236 - 241
- [48] Conducting macroporous polyaniline/poly(vinyl alcohol) aerogels for the removal of chromium(VI) from aqueous media CHEMICAL PAPERS, 2020, 74 (09): : 3183 - 3193