Biocompatibility evaluation of MEMS packaging materials for implantable devices

被引：0
|
作者：
Baum, M. [1 ]
Haubold, M. [1 ]
Besser, J. [1 ]
Wiemer, M. [1 ]
Gessner, T. [1 ,2 ]
机构：
[1] Fraunhofer ENAS, Chemnitz, Germany
[2] Tech Univ Chemnitz, Chemnitz, Germany
来源：
BIOMEDICAL ENGINEERING-BIOMEDIZINISCHE TECHNIK | 2013年 / 58卷
关键词：
biocompatibility; MEMS; packaging; corrosion; hermeticity; chip size package CSP; implant;
D O I：
10.1515/bmt-2013-4104
中图分类号：
R318 [生物医学工程];
学科分类号：
0831 ;
摘要：
Within this paper we will describe the investigations of biocompatibility testing of certain materials used for MEMS packaging and MEMS fabrication. Next to these typical semiconductor materials also nano patterned surfaces were evaluated regarding their influence to cell growth and their potential for implantable devices. Both topics were necessarily expected to be relevant for in-vivo patient monitoring applications.
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页数：2
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