Dislocation substructure-controlled softening of Cu-20Ni-20Mn alloy

被引：13
|
作者：
Luo, Fuxin [1 ]
Peng, Huaichao [2 ]
Chen, Huiming [1 ]
Xiao, Xiangpeng [1 ]
Xie, Weibin [1 ,3 ]
Wang, Hang [1 ]
Yang, Bin [1 ]
机构：
[1] Jiangxi Univ Sci & Technol, Inst Engn Res, Ganzhou 341000, Peoples R China
[2] Jiangxi Univ Sci & Technol, Sch Mat Sci & Engn, Ganzhou 341000, Peoples R China
[3] Jiangxi Yingtan Engn Res Ctr Copper Ind, Yingtan 335000, Peoples R China
来源：
MATERIALS CHARACTERIZATION | 2019年 / 147卷
基金：
中国国家自然科学基金;
关键词：
Copper alloy; Softening; Recovery; Dislocation density; Substructure; MECHANICAL-PROPERTIES; ALUMINUM-ALLOYS; HIGH-STRENGTH; PURE COPPER; MICROSTRUCTURE; EVOLUTION; DEFORMATION; TEMPERATURE; DENSITY;
D O I：
10.1016/j.matchar.2018.11.013
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The dislocation strengthening effect is generally considered to be controlled by dislocation density; however, in the present study the dislocation substructure is shown to play an even more important role for Cu-20Ni-20Mn alloy. The hardness and microstructural evolution during annealing in a hot-forged Cu-20Ni-20Mn alloy are investigated. Microstructure analysis of annealed samples indicated variation in the number of dislocations and dislocation substructure related to softening of the Cu-20Ni-20Mn alloy during static recovery. The tangled dislocations formed a regular array during annealing at 600 degrees C, leading to a high softening fraction of 95%. In addition, rapid dislocation annihilation and sub-boundary disintegration occurred during annealing owing to the dislocation climb at 650 degrees C. The number of mobile dislocations within the grains decreased considerably, leading to softening in the Cu-20Ni-20Mn alloy annealed at 650 degrees C.
引用
收藏
页码：253 / 261
页数：9
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