Advances in Steep-Slope Tunnel FETs

被引:0
|
作者
Tomioka, Katsuhiro [1 ,2 ,3 ]
Motohisa, Junichi [1 ,2 ]
Fukui, Takashi [1 ,2 ]
机构
[1] Hokkaido Univ, Grad Sch Informat Sci & Technol, Kita 13,Nishi 6, Sapporo, Hokkaido 0608628, Japan
[2] Hokkaido Univ, Res Ctr Integrated Quantum Elect, Kita 13,Nishi 6, Sapporo, Hokkaido 0608628, Japan
[3] JST PRESTO, Saitama, Japan
来源
2016 46TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE (ESSDERC) | 2016年
关键词
Tunneling FET; III-V compound semiconductors; nanowires; heterojunction; TRANSISTOR; VOLTAGE; GROWTH; HETEROJUNCTION; NANOWIRES; SI;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Tunnel FETs (TFETs) with steep subthreshold slope have been attracting much attention as building blocks for future low-power integrated circuits and CMOS technology devices. Here we report on recent advances in vertical TFETs using III-V/Si heterojunctions. These heterojunctions, which are formed by direct integration of III-V nanowires (NWs) on Si, are promising tunnel junction for achieving steep subthreshold slope (SS). The III-V/Si heterojunction inherently forms abrupt junctions regardless of precise doping technique because the band discontinuity is determined by only the offset of III-V and Si, and depletion region can be controlled by the III-V MOS structure. Thus, good gate-electrostatic control with a large internal electrical field for modulation of tunnel transport can be achieved. Here we repot on recent advances in the vertical TFETs using the III-V NW/Si heterojunction with surrounding-gate architecture and demonstrate steep-SS behavior and very low parasitic leakage current.
引用
收藏
页码:397 / 402
页数:6
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